CSP25458 - Compact wafer bonder
Estimated value
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Awarded value
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Suppliers
1
Lots
1
1 awarded
Published
22 Oct 2025
Description
***** THIS IS A CONTRACT DETAILS NOTICE, NOT A CALL FOR COMPETITION ***** This procurement is being concluded following a limited competition procurement exercise. Contract details notice for the supply of Compact Vacuum Hot Flat Press for Wafer Bonding, Dry & Oil-Free Scroll Pump, Digital temperature controlled recirculating water chiller and delivery to UKRI
Scope
- Reference
- CSP25458
- Commercial tool
- Standalone contract
Submission & procedure
- Procedure
- Below threshold - limited competition
Award details
Awarded supplier(s), contract period and value as published in the award notice.
Awarded value
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Award date
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Contract start
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Contract end
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Awarded to