UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
Estimated value
£250k
Awarded value
£250k
Awarded 13 Feb 2024
Suppliers
1
Lots
1
1 awarded
Published
15 Feb 2024
Deadline 13 Feb 2024
Description
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.
Scope
- Reference
- BIP842513727
- Total value
- £250,000 excluding VAT
- Commercial tool
- Standalone contract
- Contract dates
- 15 Feb 2024 to 29 Jul 2024
- CPV classifications
- 31712000
- Particular suitability
- Small and medium-sized enterprises (SME)
Submission & procedure
- Submission deadline
- 13 Feb 2024, 12:00 am
Award details
Awarded supplier(s), contract period and value as published in the award notice.
Awarded value
£250k
Award date
13 Feb 2024
Contract start
15 Feb 2024
Contract end
29 Jul 2024
Awarded to