Supply and Installation of a Chemical Mechanical Polishing System

The Zepler Institute (ZI), University of Southampton, plans to purchase a Chemical Mechanical Polishing (CMP) system for use in state of the art wafer scale fabrication research. The tool is intended to perform Back-end-of-line wafer fabrication processes and research including the fabrication of interconnects, through Silicon Vias, wafer scale packaging and post CMOS 3D integration as well as device fabrication using III/V materials.