PS.

NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.

University of StrathclydecontractFind a Tender ↗Ref ocds-h6vhtk-03f66f32014L0024active

Estimated value

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goods

Awarded value

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Suppliers

1

1 SME

Lots

1

1 awarded

Published

03 Jul 2024

Description

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.

Scope

Reference
UOS-29902-2023
Commercial tool
Standalone contract
Main category
goods
CPV classifications
31710000
Contract locations
Scotland

Award criteria

Criteria the buyer will use to evaluate bids.

NameDescriptionTypeWeighting
Quality70quality—
—30price—

Submission & procedure

Procedure
Open procedure

Award details

Awarded supplier(s), contract period and value as published in the award notice.

Awarded value

—

Award date

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Contract start

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Contract end

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Awarded to
AC
Accelonix
SME