NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.
Estimated value
—
goods
Awarded value
—
Suppliers
1
1 SME
Lots
1
1 awarded
Published
03 Jul 2024
Other contracts from University of Strathclyde· 10
Most recent notices published by the same contracting authority.
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Other contracts awarded to Accelonix· 10
Cross-buyer view of this supplier's public-sector wins.
| Title | Type | Value | Published |
|---|---|---|---|
| UKRI 5567 - Precision Pick and Place Tool | contract | — | 31 Mar 2026 |
| UKRI 5567 - Precision Pick and Place Tool | contract | — | 06 Mar 2026 |
| CSP26167- Vanstron - PTB-460SE-500 - 500mm linking conveyor | contract | — | 10 Feb 2026 |
| GB-Didcot: UKRI-4586 Automatic Wire Bonding Machine | contract | £136k | 27 Jan 2025 |
| GB-Leeds: 2022-23/2130- Supply of a wire bonder for ribbon/wire, ball and bump bonding | contract | £45k | 12 Oct 2023 |
| UKRI- RE22445 - Heavy Wire Bonder Competitive quotation | contract | £41k | 26 Oct 2022 |
| UKRI-2429 Hesse BJ855 | contract | — | 21 Sept 2022 |
| UKRI-2429 Hesse BJ855 | contract | — | 21 Sept 2022 |
| UKRI-2429 Hesse BJ855 | contract | £176k | 21 Sept 2022 |
| UKRI RE20534 Flexible Wirebonder System | call off | £178k | 07 Jan 2021 |